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封装品种

DIP Series

DIP400mil

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Production Overview

Plastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole PTH technology. It is widely used in low cost and manual applications. NFME offers DIP400mil with lead counts 28&32, the lead pitch is 1.778mm (70mil), that are SDIP type.

 

Application

Dual-in-line packages are considered one of the most established industry standard packages. DIP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.

 

Features

* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound

 

Design Rule
Minimum Ink Size: 20l (500) diameter or non-ink with wafer mapping
Maximum Ink Height: 1mil(25um)
Minimum Sawing street width: 2.4 (60um)
Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

Pkg type

Pkg size

Wafer thickness

SDIP

All

10~16.8 mil (250~420 um)

 

Wire Bond Rule

 

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

 

50um (2.0mil)

200 um

150 um

Max. wire length
loop height

5000um
<400um

38um (1.5mil)

170 um

100um

Max. wire length
loop height

5000um
<400um

33 um (1.3mil)

150 um

90 um

Max. wire length
loop height

5000um
<400um

30 um (1.2mil)

150um

90 um

Max. wire length
loop height

5000um
<400um

25um (1.0mil)

70um

60um

Max. wire length
loop height

5000um
<400um

23um (0.9mil)

60 um

50um

Max. wire length
loop height

3000um
<400um

20 um (0.8mil)

60 um

50 um

Max. wire length
loop height

3000um
<400um

 

 

Package Outline

 

PKG TYPE

Lead count

Lead Pitch

Lead Width

LeadThickness

BD

POD

SDIP

28

1.778

0.46

0.25

DOWN

DOWN

SDIP

32

1.778

0.46

0.25

DOWN

DOWN

 

Packing & Shipping(Tube)

 

SDIP

PKG TYPE

Lead count

QTY/Tube

Tube/Inner Box

SDIP

28

18

35

SDIP

32

17

35