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SOT Series

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Production Overview

Plastic  Small Outline Transistor  packaging (SOT) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SOT23 ,SC70,SOT89,SOT223 packages.

 

Application

Small Outline Transistor packages are considered one of the most established industry standard packages. SOT is commonly used in wireless/RF and analog devices, portable products such as cell phones, data storage systems, notebook computers and pagers.

 

Features

* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound

(1mm=39.37mil; 1mil=25.4um)

 

Reliability Test Standards

The test criterion is zero defect out of 77 sampling units.

JEDEC Precondition J-STD-20/JESD22-A113

Temp/Humidity Test

85°C/ 85% RH, JEDEC 22- A101

Pressure Cooker Test

121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102

Temp Cycle Test

-65 ~ 150°C, JEDEC22-A104

High Temp Storage Test

150°C, JEDEC 22- A103

High Accelerated Stress Test

130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118

 

Design Rule

Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

 Maximum Ink Height: 1mil(25um)

Minimum Sawing street width: 2.4mil (60um)

Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

Pkg type

Pkg size

Wafer thickness

SOT

SOT23

9.5~11mil (240~280 um)

SOT

SC70

6.7~8.3 mil (170~210 um)

SOT

SOT223

9.5~13.4 mil (240~340 um)

SOT

SOT89

9.5~13.4mil (240~340 um)

 

Wire Bond Rule

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

 

50um (2.0mil)

200 um

150 um

Max. wire length
loop height

5000um
<300um

38um (1.5mil)

170 um

100um

Max. wire length
loop height

5000um
<300um

33 um (1.3mil)

150 um

90 um

Max. wire length
loop height

5000um
<300um

30 um (1.2mil)

150um

90 um

Max. wire length
loop height

5000um
<300um

25um (1.0mil)

70um

60um

Max. wire length
loop height

5000um
<300um

23um (0.9mil)

60 um

50um

Max. wire length
loop height

3000um
<300um

20 um (0.8mil)

60 um

50 um

Max. wire length
loop height

3000um
<300um

Package Outline

 

DIP/SkDIP/SDIP/HDIP (All units are in mm)

PKG TYPE

Lead count

Lead Pitch

Lead Width

LeadThickness

BD

POD

SOT23

3

0.95

0.38

0.15

DOWN

DOWN

SOT23

5

0.95

0.38

0.15

DOWN

DOWN

TSOT23

5

0.95

0.38

0.15

DOWN

DOWN

SOT23

6

0.95

0.38

0.15

DOWN

DOWN

TSOT23

6

0.95

0.38

0.15

DOWN

DOWN

SOT24

4

1.90

0.40

0.10

DOWN

DOWN

SC70

5

0.65

0.25

0.13

DOWN

DOWN

SC70

6

0.65

0.25

0.13

DOWN

DOWN

SOT89

4

1.50

0.40

0.40

DOWN

DOWN

SOT223

4

2.30

0.71

0.30

DOWN

DOWN

 

Packing & Shipping(Carrier Tape)

 

PKG TYPE

Lead count

Tape Width

Reel Diameter

QTY/Reel

SOT23

3

8mm

7"

3000

SOT23

5

8mm

7"

3000

SOT23

6

8mm

7"

3000

SC70

5

8mm

7"

3000

SC70

6

8mm

7"

3000

SOT89

4

12mm

7"/13"

1000/2500

SOT223

4

12mm

7"/13"

1000/2500